General Descriptions

Purpose/function of the system is to carry out surface treatment and thin film deposition & multi-coating materials at atmospherics pressure from liquid source using plasma

• Coated materials: The atmospheric plasma coating system is capable to apply coating of materials inclusive of polymer, oxides & metal oxides process able by atmospheric plasma CVD process.
• Coated substrates: wafer, plastic sheet & metal foil.
• Coating thickness range: 1~300nm

General Descriptions

• Compact, versatile vacuum coater, designed for physical vapour deposition processes under high vacuum.
• •Complete vacuum solution for the coating of both metals and non-metals on substrates providing a high level of control and uniformity.

General Specifications:

Vacuum systems

• • 450l/s dry-running maglev turbo molecular pump
• • Dry-running scroll pump

Chambers

• • FL400 front loading ‘box’ chamber. 400mm diameter x 500mm tall with 100mm diameter viewport and chamber liners
• • Water-cooled FL400 chambers for use with high temperature substrate heating until 300 0C.

Controls and safety

• • PLC system controller with touch-screen for vacuum system
• • Control Automatic high vacuum valve protects pumps and process
• • Comprehensive interlocks to maximize operator safety
• • The Auto500 carries the CE mark

Power

• • RF power 600 w output or higher and DC power 1000w or higher
• • 2 MFC unit for process gas (argon) and reactive gas.

General Descriptions:

• Compact, versatile vacuum coater, designed for physical vapour deposition processes under high vacuum.
• Complete vacuum solution for the coating of both metals and non-metals on substrates providing a high level of control and uniformity.

General Specifications:

• Weight:  450Kg.

•  

  Dimensions:  1.891m(H) X  1.230m(W) X  0.650m(D)

•  

  Supply voltage:  240V 50Hz 1-phase.

•  

  Supply pressure range:  2.7 to 7 Bar.

•  

  Supply temperature range:  5°C to 20°C.

General Descriptions:

The Reactive Sputtering System is depositing high uniformity lll – V nitrides (GaN, AlN, InN, AlGaN) film on 3” substrates or bigger. The RF Sputtering is designed for ease of operation simple push button control are used to start and stop the system, as well as to initiate a multilayered process under microprocessor control, in this multi-layering process, layer can be either added or removed. The pre-cleaning and multilayer deposition from approximately 25 Angstroms to microns can be tailored for four different materials in a single batch. Uniformity over 4” wafers is better than ±3%, deposition rate are from approximately 10–100 Angstroms/sec depending on material and sputter power.

General Descriptions:

The E-Beam Evaporator System is for deposition of refractory metal and dielectrics film on 3” substrates or bigger. The System is made with stainless steel chamber (24” diameter) with copper gasket sealed ports. The chamber enhancement including baking strips and bake out controller, large access door, top flange wire seal and hoist an 8” cryopump and large gate valve and 3” magnetron gun. The system is capable of 10 – 9 TORR scale operation or lower with backing. The E-Beam power supplies are 5.5 kW or better with X Y sweep control.

General Descriptions:

The AUTO 306 is a microprocessor controlled vacuum coater that can be configured to perform a variety of coating task. The flexibility is achieved by a wide range of functional accessories to a standard base unit. The main elements of the AUTO 306 are:

• •A vacuum pumping system.
• •A microprocessor control system and control panel.
• •A base plate.
• •Cabinet.

The AUTO 306 is designed for physical deposition processes under high vacuum and is not suitable for use on processes involving chemical vapour deposition. The vacuum pumping consists of an oil vapour diffusion pump, backed by a rotary pump.

General Descriptions:

The Plasmalab 80Plus system is a highly versatile, open loaded processing platform, designed with multiple processing configurations for maximum process flexibility. It can be configured with RIE, PE, PECVD or ICP chamber configurations. This system is ideally suited for R&D or small-scale production where up to 9pcs of 2” wafers can be processed on the 240m electrode. The open load design allows for fast loading and unloading, ideal for prototyping and volume production environments.

General Descriptions:

• Important parts of an integrated artwork generation system.
• Placed in a suitable darkroom, which films can be safely handled without any exposure.

General Descriptions:

• Consists of console that holds the alignment module, alignment optics and transport platform, and light source.
• Mounted on pneumatic spring vibration isolators to facilitate alignment of very small structures.

General Descriptions:

Uses for high voltage electrical power, mechanical motion, and varying temperatures in the processing of semiconductors

General Descriptions:

The Screen-A-Print integrates 4 machines into one compact system. There is no need for additional pieces of equipment. The work light tables, exposure station, printing station and drying station are incorporated into the machine. Utilizing only 8 square feet of space in use, and 4 square feet of space when stored, this compact unit can be operated in any space including a spare room, basement or garage. Built on a stand on wheels, the machine is portable and can easily be moved from site to site or room to room. Print on any flat surface. The Screen-A-Print is extremely versatile and can print on silicon wafer.

General description :

PTL-OV5P  is a CE Certified Programmable Dip Coater (1-200 mm/min) designed to preparing multilayer coating up to 5 solutions inside a temperature controlled oven with touch-screen digital control. Dipping rate, pulling rate, dwell time, and amount of cycles can be setup by touch screen controller. It is designed for R&D Lab to prepare various optical or epitaxial films from liquid solution.

General descriptions :

The standard glass set, where the condenser is tilted to be set, suitable for distillation, concentration, and collection of samples.

General descriptions :

The Potentiostat 466 features potentiostat / galvanostat / ZRA operation as well as two extra general purpose channels for simultaneous recording of ancillary signals such as temperature, light intensity, pressure, or from a quartz crystal microbalance. Potentiostat, waveform generator and data acquisition functions are all housed in the one small footprint enclosure. Waveforms are generated by an internal DAC but there is also an input socket for connection of an external waveform generator.

Sophisticated digital signal processing ensures high resolution, low noise signals. A ‘mains filter’ rejects 50 or 60 Hz mains hum (often the dominant source of noise in an electrochemical experiment). Signals are transmitted by USB to your computer without the need for internal computer cards or special cables!