General Descriptions:

The Screen-A-Print integrates 4 machines into one compact system. There is no need for additional pieces of equipment. The work light tables, exposure station, printing station and drying station are incorporated into the machine. Utilizing only 8 square feet of space in use, and 4 square feet of space when stored, this compact unit can be operated in any space including a spare room, basement or garage. Built on a stand on wheels, the machine is portable and can easily be moved from site to site or room to room. Print on any flat surface. The Screen-A-Print is extremely versatile and can print on silicon wafer.

Machine Features:

Platens: Each machine comes with 3 different platens: adult, baby, leg and sleeve

Height adjustment: A crank handle allows for Platen height adjustment by simply cranking a handle and moving the platen up and down. For bulky items or smaller items, this height adjustment is an absolute necessity to printing.

Tilting Mechanism: For un-even items or those without a uniform shape, the tilting mechanism allows for you to maneuver the platen into the proper position to print.

Screen Rack: Easy to reach storage area for screens when not in use

Stand with Casters: Designed on a stand on casters, the machine can be easily rolled away for storage, from room to room, and in and out of

Applications:

Transferring metal pattern for solar cells

Reference: Manual Book for Screen-A-Print; Model: 1600NO

General Descriptions:

Uses for high voltage electrical power, mechanical motion, and varying temperatures in the processing of semiconductors.

Specifications:

   Spinner Dimensions: 15” (H) 13.10” (W) 5.85” (D)

   Power requirements: 95 VAC to 240 VAC, 48 to 63 HZ at 2 Amps.

   Ambient temperature: 17 to 250C.

Applications:

   Uniforms thin film to flat substrate.

   Thin films with thicknesses below 10 µm.

   Used intensively in photolithography, to deposit layers of photo-resist about 1 µm thick.

Reference: Manual Book for Single Wafer Spin Processor; Model: WS- 400B-6TFM

General Descriptions:

Consists of console that holds the alignment module, alignment optics and transport platform, and light source. Mounted on pneumatic spring vibration isolators to facilitate alignment of very small structures.

Specifications:

Alignment Module:

   Vacuum Chuck X, Y, travel: 0.47” (12mm)

   Vacuum Chuck Z, travel: 0.12 (3mm)

   Vacuum Chuck rotation: 7”

   Substrate size accommodation: Up to 6” 6”

   Micrometer Graduations: 0.001mm

   Mask size accommodation: 2” 2” to 7” 7”

   Mask rotation: Rotating: 5”

   Pivoting: 1.5”

Light source:

   Lenses: 5” or 7” diameter or 10” truncated Schott BK-7 or fused silica.

   Power ratings (watt): Near UV – 200, 350, 500, 1000 Watts

   Deep UV – 500, 1000 Watts.

   Constant Intensity Controller: Maintains intensity to 2% of operator set value throughout life of the lamp with the line voltage variations of 15%.

   Shutter Timer/Field Illuminator: Exposure time ranges of 0.1 to 99.9 seconds and 1 to 999 seconds. Voltage controls 0-6 VAC, 35 watts maximum.

Alignment Optics:

   Stereo Microscopes: EM Series, MEIJI Techno America.

   Split-field: Zoom Series NAVITAR – Dual CCTV system with 2 @ 9” monitors, single CCTV system with 1 @ 12” monitor.

Dimensions:

   Console: 31” (78.7cm)W 35” (140cm)H 24” (61cm)

   Weight: 250 lbs (114 Kg)

Applications:

Can be configured to accommodate a wide variety of substrate size, shapes and materials from pieces of substrates up to 6” diameter wafers or even 6” 6” square substrates. The system is capable of masks handling from 2” 2” to 7” 7” and resolution of one-micron structures with overlay of 0.2 microns.

Reference: Manual Book for Table-Top Series Mask Aligner and UV Exposure System; Model: 847

General Descriptions:

Important parts of an integrated artwork generation system. Placed in a suitable darkroom, which films can be safely handled without any exposure.

Specifications:

   Maximum image area: 610 720 (mm), 24” 28” (inches)

   Overall Accuracy: 9 m = 0.4 mil

   Repeatability: 4 m = 0.2 mil

   Resolution: mil

   Operating environment: 20 to 21 , humidity between 50% to 60%.

   Power requirements: 230 V or 115 V, 50/60 Hz at 250 Watts, when idling: 75 Watts.

   Dimensions: 37.5” (H) 53.2” (W) 43.5” (D)

   Weight: 330 Kg

Applications:

Used to generate precise films or glass plates to be used as masks in the production of PCBs and hybrid circuits. Capable to produce photo tools for etching processes and other processes that requires precise images. The images are created by exposing and developing a photographic emulsion, which is fixed to a medium such as film, glass or acrylic plates.

Reference: Manual Book for MIVATEC; Model: MIVA-T3

General Descriptions:

The Plasmalab 80Plus system is a highly versatile, open loaded processing platform, designed with multiple processing configurations for maximum process flexibility. It can be configured with RIE, PE, PECVD or ICP chamber configurations. This system is ideally suited for R&D or small-scale production where up to 9pcs of 2” wafers can be processed on the 240m electrode. The open load design allows for fast loading and unloading, ideal for prototyping and volume production environments.

System features:

The vacuum chamber is configured for optimal gas conductance at the wafer thus maximizing etch rate and uniformity.

The use of axially symmetric gas flow design also ensures excellent across chamber uniformity.

Substrate control is provided by a wide range of electrodes.

Process gas lines are made of orbitally welded, internally polished stainless steel tubing.

6 lines gas pod houses all gas flow components and remotely sited away from the main process tool.

Process chamber machined from single aluminum block for ultimate vacuum integrity.

Process pressure control provided by an automatic pressure control valve, vacuum isolation provided by a pneumatic gate valve.

Radial pumping configuration for enhanced process uniformity.

Performance Specifications:

GaN Etching:

   Etch rate: >250nm/min

   Uniformity: <±3% over 2” wafer

   Profile: >85%

   Selectivity to oxide/Nitride: >5:1

   Etch rate: >200nm/min

   Uniformity: <±3% over 2” wafer

   Profile: >85%

   Selectivity to photoresist (PR) of at least 0.6~0.8:1

SiO2 Etching:

   Etch rate: >35nm/min

   Uniformity: <±3% over 2” wafer

   <±5% over 8” wafer

   Profile: >85%

   Selectivity to photoresist (PR) of at least 3~5:1

Si3N4 Etching:

   Etch rate: >50nm/min

   Uniformity: <±3% over 2” wafer

   <±5% over 8” wafer

   Profile: >85%

   Selectivity to photoresist (PR) of at least 1.5~3:1

Applications:

The 80Plus platform is ideal for fast prototyping and development for optoelectronic and microelectronic applications. The ICP-RIE system is used for anisotropic etching of GaN, SiO2 and Si3N4. It is routinely used in the manufacture of semiconductor laser diodes and light emitting diodes (LEDs), with processes ranging from the dry etching on InP based layers for mesa formation to the NH-3 free nitride for passivation and masking.

Reference: Manual Book for Inductive Couple Plasma Etching System (ICP-RIE); Model: Oxford Plasmalab 80 Plus.

General Descriptions:

The AUTO 306 is a microprocessor controlled vacuum coater that can be configured to perform a variety of coating task. The flexibility is achieved by a wide range of functional accessories to a standard base unit.

The main elements of the AUTO 306 are:

   A vacuum pumping system.

   A microprocessor control system and control panel.

   A base plate.

   Cabinet.

The AUTO 306 is designed for physical deposition processes under high vacuum and is not suitable for use on processes involving chemical vapour deposition. The vacuum pumping consists of an oil vapour diffusion pump, backed by a rotary pump.

Applications:

The AUTO 306 system is designed for coating a thin film on to the substrate sample. This system using the evaporation technique. The materials who want in evaporate to be heat at high current until melt. However material will be utilized not to high melting point.

Specifications:

Rotary pump

Diffusion pump - The diffusion pump is an Edward E04/160K and is mounted vertically beneath the base plate. It is capable of pumping the process chamber down to a pressure below 2 x 10-7 Mbar.

Electrical control cabinet

Filament holder or turnent source

Plasmaglo bombarding rings

Radiant heater

Source heater

LT / HT controller

HT power supply

Baffle plate and tripod

Reference: Manual Book for Vacuum Coater Unit; Model: Auto 306