Fabrication Laboratory
E-BEAM EVAPORATOR
DESCRIPTION
Process 1)
Deposition materials : Metal deposition (Ni, Ti, Al, Au, Pt,..) 2) Wafer size: Piece , 2 inch, 4inch 3) Product yield : 4 wafers/run (@ 4inch) 4) Ultimate pressure : < 5.0 × 10-7 Torr 5) Thickness uniformity : Within Wafer ≤±3% Run to Run ≤±5% 6) Substrate rotation by motor 7) E-beam gun (15cc*6 pocket) 8) E-beam power supply (6KW) 1set 9) Pocket selector 10) Thickness monitor + Sensor 1ea 11) Cryo pump + Rotary pump 12) PLC + PC control + Touch screen control.
SYSTEM FEATURES
Process Chamber Module
Process chamber
– Manual front access door type D shape SUS chamber
– 2(two) view port with shutter
– Easily removable cleaning cover (SUS304)
– Vacuum baffle (SUS304)
– Chamber purge & vent
– Substrate shutter open/close by air cylinder
– E-beam gun shutter open/close by air cylinder
– In-vacuum water leak sensor
Substrate holder
– Substrate : Piece , 2 inch, 4inch
– Product yield : 4 wafers /run
– Rotation speed : 5~30 rpm
– Substrate rotation by AC motor
– Glow discharge compatible
Substrate heater
– Adjustable temperature control
– Halogen lamp max. temp.: 400℃
– K type thermocouple
E-beam Module
E-beam power supply
– High voltage output: 6KW @ 8kV max
– Voltage adjustable from 6kV to 8Kv
– Beam current adjustable 0~750mA
– Tetrode tube for superior instantaneous arc down recovery
– Constant emission current regulation
Thickness Controller Module
Thickness monitor
– Frequency Resolution : 0.03 [Hz]
– Measurement interval : 0.1 sec
– Crystal starting frequency : 5 or 6 MHz
– Number of processes : 99
– Number of layers : 999
Oscillator package
Thickness sensor
– Standard sensor head type
– Water feedthrough
Vacuum Module
Vacuum pump
– Cryo pump -. Pumping speed: 4,000 ℓ/sec
– Rotary pump
-. Pumping speed: 670ℓ/min(@60Hz), 550ℓ/min(@50Hz)
-. Inlet connection: NW25 -. Outlet connection: NW25
– Ultimate pressure : 5×10-7 Torr l Pressure gauge
– Full range vacuum gauge : 760 torr ~ 5 x 10-9 torr
– Pressure readout & cable kit l Vacuum valves & lines
– Main valve : Pneumatic type gate valve – Fore line valve : Pneumatic type angle valve
– Roughing line valve : Pneumatic type angle valve
– Auto vent line
– Stainless steel hard line and flexible bellows line
Gas Delivery Module
Used gases & flow control
– Purge & vent : N2 : Metering valve
Gas valves & gas line
– Pneumatically operated diaphragm valve
– Metering valve for N2 purge & vent
– The gas line is helium-leak tested to 10-8 Torr·L/sec
Control Module
System control
– System is controlled by PC
– Industrial PC (PENTIUM, 17” LCD monitor)
– Including analog & digital input/output card
– Process control software
– User friendly screen & easy Graphic User Interface (GUI)
– Process data logging
– Recipe edit, save, download, run l 19” standard rack with electrical contact mechanism
– Electrical power drive panel (ON/OFF/Emergency switch)
– Beam sweep controller panel
– E-Beam power controller panel
– Crucible index controller panel
– Thickness monitor panel
– Vacuum gauge controller panel
– Shutter open/close operation panel
– Schematic panel
Provide thickness uniformity simulation data (by using UEASE tool)
Frame Module
System frame is mild steel
– White & Blue colored panels & frame covers
– 19inch control panel mountable
– Easily movable casters & leveling foots
APLICATION USE
Electron beam applications. We use electrons as a versatile tool. ... Thermal electron beam processes, based on the local heating of metals from energy input via electrons, can be used for welding, curing, microstructuring and joining processes, and for evaporating materials.
