EQUIPMENT

UPG 101 Maskless lithography Manufactured by Heidelberg-instruments utilizes methods that directly transfer the information onto the substrate, without utilizing an intermediate static mask, i.e. photomask that is directly replicated. In lithography process, UV radiation will be used to transfer an image of a time constant mask onto a photosensitive resist.

The Olympus BX53M-S is a well-designed and easy-to-use simplified complex microscope. The easy, comfortable operation of the BX53MRF-S also improves reproducibility by minimizing human error. The observation method, illumination intensity, and magnification are automatically recorded by the software and stored with the associated images.

The POLOS SPIN150i spin coater is a versatile and high-quality substrate spin coater, made out of PTFE or NPP. It is specifically designed for R&D and low volume production. Users may program the spin coater with custom programs of the system for the deposition of uniform thin layer especially for photoresist process.

The High-Resolution Photolithography Mask Aligner is a precision microfabrication system designed to achieve pattern transfer with a resolution of 1 µm or better. It features a semi-automatic operation mode with keypad and LCD touch panel control, supported by a microprocessor and pneumatic system to ensure accurate, repeatable alignment and exposure processes. The system utilizes a 350 W short-arc UV lamp with a wavelength range of 350–450 nm, delivering an intensity of ≥20 mW/cm² at 365 nm with excellent beam uniformity of ≤ ±3%, suitable for consistent photoresist exposure. It supports substrates up to 4 inches in diameter and mask sizes up to 5 × 5 inches, providing flexibility for various applications including MEMS, integrated circuits, and photonic devices. The alignment stage allows precise movement in X and Y (±5 mm), theta (±4°), and Z (≥5 mm) directions. Multiple contact modes—vacuum, soft, hard, and proximity—enable process optimization based on resolution and defect control requirements. An integrated microscope with variable magnification from 1.5× to 9.0× enhances alignment accuracy and user control.